Automatic galvanizing and electroplating equipment
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13933151511Equipment flow:
Development - overflow water washing (1) (2) - clean washing - dry board combination - board out
Equipment specification:
External dimension of the equipment: 6848mm (L) * 2500mm (W) * 2500 ± 25mm (H) (the production rate is roughly proportional to the length of the equipment)
PCB board specification: I) 610 mm * 610 mm []
II) 200 mm * 200 mm [small]
III) 0.05-3.2 mm (excluding copper) [thickness] [standard: 35 wheelbase]
Production speed: 0.6-8 M / min (adjustable) [preset working yield: 2.5 m / min]
Equipment features:
1. Develop the anti pool effect design of horizontal swing nozzle with independent pressure regulation, spray more evenly and produce more smoothly;
2. The development is equipped with mechanical (or vacuum) foam breaking device to avoid defoamer pollution and effectively reduce liquid waste;
3. The width of etch line is 2mil / 2mil, the etching uniformity c.o.v ≥ 96%, etching factor ≥ 5;
4. The conical drum type membrane slag separation system can efficiently and cleanly collect and treat the membrane slag;
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