Automatic galvanizing and electroplating equipment
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13933151511PCB inner circuit etching production line
Equipment flow:
Plate entry - Development - compensation development - sewage flushing - overflow water washing (1) (2) (3) (4) (5 - clean water washing - Inspection (1) - compensation etching - etching - overflow water washing (6) (7) - clean washing - Inspection (2) - film stripping - sewage flushing - overflow water washing (8) (9) - acid washing - overflow water washing (10) (11) (12) - clean washing - dry board combination - board discharging
Equipment specification:
External dimension of the equipment: 23848mm (L) * 2500mm (W) * 2500-25mm (H) (the production rate is roughly proportional to the length of the equipment)
PCB board specification: I) 610 mm * 610 mm []
II) 200 mm * 200 mm [small]
III) 0.05-3.2 mm (excluding copper) [thickness] [standard: 35 wheelbase]
Production speed: 0.6-8 M / min (adjustable) [preset working yield: 2.5 m / min]
Equipment features:
1. The development and etching can independently adjust the pressure of horizontal swing nozzle anti pool effect design, spray more uniform, production more smooth;
2. The development is equipped with mechanical (or vacuum) foam breaking device to avoid defoamer pollution and effectively reduce liquid waste;
3. The development design has a fully automatic developing point measuring program, which is convenient for production and operation;
4. The width of etch line is 2mil / 2mil, the etching uniformity c.o.v ≥ 96%, etching factor ≥ 5;
5. The results show that the cross inclined spray can wash the film more effectively;
6. The conical drum type membrane slag separation system can efficiently and cleanly collect and treat the membrane slag;
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