Why is there side etching in the whole process of hardware etching? The following hardware etching equipment manufacturers explain for you. There are two important and more critical parameters in hardware etching. The etching rate determines the length of the etching production cycle time. The faster the etching rate is, the less the etching production cycle time is, and the higher the production rate is. On the contrary, the productivity is lower. On the whole, hardware etching is the general term of metal material etching, and it is called hardware etching for parts. Because only the surface etching, i.e. the surface layer is beginning to touch the potion. At this time, due to the liquid correlation, the surface will spread out from the beginning of the etching time, resulting in the lateral erosion of the outer wall. At this time, we should grasp the etching rate, which will harm the precision of the commodity. However, the faster the etching rate is, the better

1. The faster the etching rate is, the larger the amount of metal material is etched in unit time, the calorific value increases, and the temperature of etching solution changes rapidly, which is unfavorable to the stability of etching rate;

2. The etching rate is too fast, and it is difficult to control the processing of parts with deep requirements;

3. The faster the etching rate is, the lower the quality of the metal surface after etching, which significantly damages the smoothness and smoothness of the etched surface;

4. High etching rate usually requires high concentration of etchant, high corrosive chemicals and high etching temperature. This factor increases the cost of corrosion agent, and increases the cost of corrosion resistant layer.

In addition, higher concentration of corrosive agent and high etching temperature will increase the environmental pollution of the natural environment and harm to the actual operating staff.

In the specific application, for these parts with a large amount of etching, the hardware etching equipment manufacturers can choose the way of "fast before and slow after". In other words, "fast before slow" means that the etching solution with fast etching rate is used to carry out an etching. When the etching depth is close to the specified value of the design scheme, the etching solution with slow etching rate is used for precision etching. Although the process flow is improved, the production and processing time is reduced, and the etching precision and surface smoothness are ensured. For rapid etching time, it must be determined according to the part processing regulations, and 80% - 90% of the total etching amount is suitable.